BGA/LGA with built in heat slug/spreader

Details BGA/LGA with built in heat slug/spreader BGA/LGA with built in heat slug/spreader

2005-05-31

2005-05-31

Pert, Evan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S720000, C438S106000, C174S252000

Reexamination Certificate

active

06900535

ABSTRACT:
A ball or land grid array plastic substrate portion is formed with a hole therethrough in the region on which the integrated circuit die is to be formed, with a copper heat slug inserted within the opening having a bottom surface substantially aligned with the bottom surface of the plastic portion to allow molding tooling for conventional ball or land grid array packages to be employed. The integrated circuit die is mounted on the heat slug, which has a solderable bottom surface and is directly soldered to the PCB. An additional copper heat spreader region is formed on an upper surface of the plastic portion.

REFERENCES:
patent: 5583377 (1996-12-01), Higgins, III
patent: 5717252 (1998-02-01), Nakashima et al.
patent: 5856911 (1999-01-01), Riley

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