LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Insulating material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Arrangement in semiconductor packages for inhibiting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Array-molded package heat spreader and fabrication method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Assembly and methods for packaged die on pcb with heat sink...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Assembly structure of electronic element and heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Assembly with a ring and bonding pads formed of a same...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Back-face and edge interconnects for lidded package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array integrated circuit package with palladium...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package comprising a heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package enhanced with a thermal and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package having one or more stiffeners

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package with patterned stiffener layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array package with patterned stiffener surface and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array structure and method for packaging an integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array type package for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball-grid-array-type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Barrier layers for thin film electronic materials