Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-10-24
2006-10-24
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S706000, C257S707000, C257S727000, C313S512000
Reexamination Certificate
active
07126217
ABSTRACT:
In a semiconductor flip-chip package having a semiconductor die104as part of a substrate assembly, a lid110(or lid assembly) and substrate102are supported to prevent tilting and teetering of the lid. The lid and substrate do not adhere, so as to reduce cracking of solder joints due to thermal cycling induced by repeated system power on-off. An adhesion prohibitor315, 325may be applied so that a support314, 324does not adhere to both lid and substrate; the support314, 324may be prevented from adhering to both lid and substrate by a separate curing step. The arrangements and fabrication methods may be applied to many package types, including ball grid array (BGA) and land grid array (LGA) packages.
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Chiu Tz-Cheng
Dunne Rajiv Carl
Brady III Wade James
Chu Chris C.
Parker Kenneth
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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