Flip chip package including a non-planar heat spreader and...
Flip chip package structure
Flip chip package with improved cap design and process for...
Flip-chip ball grid array package with a heat slug
Flip-chip semiconductor device having an improved reliability
Fluoropolymer dielectric composition for use in circuitized...
Fluxless die-to-heat spreader bonding using thermal...
Formation of metal oxide gate dielectric
Forming a semiconductor package including a thermal...
Forming a substantially planar upper surface at the outer...
Functionally gradient integrated metal-ceramic member and semico
Gel thermal interface materials comprising fillers having...
Glass lid, and package provided with such a lid, for the...
Graded liquid crystal polymer package
Grid array device package including advanced heat transfer mecha
Ground arch for wirebond ball grid arrays
Heat conductive plate structure
Heat dissipating microelectronic package
Heat dissipating package structure and method for...
Heat dissipation apparatus for package device