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Flip chip package including a non-planar heat spreader and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Flip chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Flip chip package with improved cap design and process for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Flip-chip ball grid array package with a heat slug

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Flip-chip semiconductor device having an improved reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Fluoropolymer dielectric composition for use in circuitized...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Fluxless die-to-heat spreader bonding using thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Formation of metal oxide gate dielectric

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Forming a semiconductor package including a thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Forming a substantially planar upper surface at the outer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Functionally gradient integrated metal-ceramic member and semico

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Gel thermal interface materials comprising fillers having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Glass lid, and package provided with such a lid, for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Graded liquid crystal polymer package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Grid array device package including advanced heat transfer mecha

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Ground arch for wirebond ball grid arrays

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat conductive plate structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipating microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipating package structure and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat dissipation apparatus for package device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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