Structures for improving heat dissipation in stacked...
Structures to enhance cooling of computer memory modules
Subassembly that includes a power semiconductor die and a...
Substrate for resin-encapsulated semiconductor device,...
Substrate for semiconductor device and semiconductor device
Substrate for use in wafer attracting apparatus and manufacturin
Substrate having a functionally gradient coefficient of...
Substrate having a functionally gradient coefficient of...
Substrate including a metal portion and a resin portion
Substrate structure of BGA semiconductor package
Substrate-less microelectronic package
Substrate-less microelectronic package
Substrates and assemblies including pre-applied adhesion...
Substrates and assemblies including pre-applied adhesion...
Super low profile package with high efficiency of heat...
Supporting a circuit package including a substrate having a...
Supporting a circuit package including a substrate having a...
Surface mount ceramic package
Surface mount package with improved heat transfer
Surface mount package with low coefficient of thermal expansion