Substrate-less microelectronic package

Details Substrate-less microelectronic package Substrate-less microelectronic package

2005-11-15

2005-11-15

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S777000

Reexamination Certificate

active

06965163

ABSTRACT:
A microelectronic die assembly including a heat dissipation device serving as a support structure for the assembly is described. A first microelectronic die is attached by a back surface to a first surface of the heat dissipation device. A first plurality of interconnects are disposed on an active surface of the first microelectronic die. A second microelectronic die is attached by a back surface to the first microelectronic die active surface. A second plurality of interconnects are disposed on an active surface of the second microelectronic die. Any appropriate number of microelectronic dice may be stacked in a like fashion.

REFERENCES:
patent: 5910682 (1999-06-01), Song
patent: 6081028 (2000-06-01), Ettehadieh et al.
patent: 6265771 (2001-07-01), Ference et al.
patent: 6339254 (2002-01-01), Venkateshwaran et al.
patent: 6369448 (2002-04-01), McCormick
patent: 6590281 (2003-07-01), Wu et al.
patent: 6665187 (2003-12-01), Alcoe et al.
patent: 2003/0148554 (2003-08-01), Gerber et al

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