Surface mount package with improved heat transfer

Details Surface mount package with improved heat transfer Surface mount package with improved heat transfer

1995-08-18

1997-04-29

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257675, 257707, 257720, 257719, H01L 23495, H01L 2310, H01L 2334

Patent

active

056252269

ABSTRACT:
One surface of a metal heat transfer slug contacts the surface of a semiconductor die which contains junction diffusions. The slug and die are molded into a surface mount package which exposes the opposite surface of the slug. Terminal leads are internally connected to the junction diffusions and extended beyond the molded periphery of the package.

REFERENCES:
patent: 4891686 (1990-01-01), Krausse
patent: 5345106 (1994-09-01), Doering et al.
"Electronic Packaging and Interconnection Handbook", pp.7.24-7.25; C. Harper.

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