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Integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package and method for fabricating same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package and method for fabricating same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package and system interface

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package and system interface

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package design with non-orthogonal die...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package employing a heat-spreader member

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package for the transfer of heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package having a castellated heatspreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package having adhesive bead supporting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package including a heat sink and an adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package lid

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package lid with a wetting film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package receptacle

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package substrate having a thin film...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package system with a heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package with flat-topped heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package with integral leadframe convector...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package with top-side conduction cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit packages and the method for the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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