Integrated circuit package system with a heat sink

Details Integrated circuit package system with a heat sink Integrated circuit package system with a heat sink

2006-02-10

2011-10-04

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S718000, C257S719000, C257S720000, C257S796000, C257SE33075, C257SE23051, C257SE23094, C257SE23103, C438S122000

Reexamination Certificate

active

08030755

ABSTRACT:
An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated circuit die, and encapsulating the resilient thermal structure.

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patent: 2002/0015288 (2002-02-01), Dibene et al.
patent: 2004/0075168 (2004-04-01), Azuma
patent: 2004/0164402 (2004-08-01), Yoshimura
patent: 2005/0269675 (2005-12-01), Prindiville

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