Integrated circuit package and system interface

Details Integrated circuit package and system interface Integrated circuit package and system interface

2006-08-18

2008-11-25

Ngo, Ngan (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S728000, C257SE23080, C257SE23101

Reexamination Certificate

active

07456498

ABSTRACT:
A method for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.

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patent: 6346679 (2002-02-01), Nakamura
patent: 6603205 (2003-08-01), Miura
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patent: 2006/0138630 (2006-06-01), Bhakta
patent: 2006/0138649 (2006-06-01), Karnezos

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