Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1997-04-18
2000-03-07
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257704, H01L 23053
Patent
active
060344296
ABSTRACT:
A package for an integrated circuit is described, as is a method of making the package. The package is comprised of a substrate having a substantially planar first surface on which an integrated circuit die is placed. An imperforate adhesive bead on the first surface of the substrate surrounds the die. A lid transparent to electromagnetic radiation such as ultraviolet light is spaced above the integrated circuit, in a press-fitted interconnection with the bead. Epoxy is a preferred material for the bead. The lid is a single-piece of flat material, such as plastic, ceramic, or glass, which can have a diagonal edge.
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Glenn Thomas P.
Hollaway Roy D.
Panczak Anthony E.
Amkor Technology Inc.
Jr. Carl Whitehead
MacPherson Alan H.
Parsons James E.
Potter Roy
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