LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Encapsulated

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Epoxy resin compositions and semiconductor devices encapsulated

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Patent

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Epoxy resin molding material for sealing use and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Epoxy resin molding material for sealing use and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Epoxy-resin systems, which are resistant to aging, moulding...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Exposed die overmolded flip chip package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Externally-embedded heat-dissipating device for ball grid...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Reexamination Certificate

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Flexible carrier for high volume electronic package fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Flexible hermetic sealing

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Flexible integrated monolithic circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Flexible printed board

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material

Reexamination Certificate

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Flexible wiring board for tape carrier package having...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip chip interconnection pad layout

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Flip chip interconnection pad layout

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Flip chip semiconductor device in a molded chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Flip chip with integrated flux and underfill

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Flip-chip package with underfill dam for stress control

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip packaging method that treats an interconnect...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Flip-chip semiconductor devices having two encapsulants

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Patent

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Flip-chip type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Flip-chip type semiconductor device sealing material and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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