Epoxy resin molding material for sealing use and...

Details Epoxy resin molding material for sealing use and... Epoxy resin molding material for sealing use and...

2008-07-08

2008-07-08

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S789000, C257S792000, C257S793000, C257S794000, C257S795000, C257SE23107, C257SE23121

Reexamination Certificate

active

07397139

ABSTRACT:
An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.

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