Flexible wiring board for tape carrier package having...

Details Flexible wiring board for tape carrier package having... Flexible wiring board for tape carrier package having...

2007-07-03

2007-07-03

Hoang, Quoc (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S643000, C257SE21499, C438S124000, C438S508000

Reexamination Certificate

active

11258940

ABSTRACT:
A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.

REFERENCES:
patent: 4795693 (1989-01-01), Ors et al.

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