Flexible carrier for high volume electronic package fabrication

Details Flexible carrier for high volume electronic package fabrication Flexible carrier for high volume electronic package fabrication

2011-06-28

2011-06-28

Nguyen, Khiem D (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S788000, C257SE23055, C438S118000, C118S621000, C451S093000, C451S494000

Reexamination Certificate

active

07969026

ABSTRACT:
An assembly for producing partially packaged semiconductor devices is provided. In one embodiment, the assembly includes a magnetic plate; a flexible substrate disposed adjacent the magnetic plate and having two surfaces; a nonstick coating disposed on one surface of the flexible substrate thereby exposing a nonstick surface; and a tape layer having two surfaces. The tape layer is adhesively attached to the nonstick surface to expose a surface of the tape layer. A frame is disposed on the exposed surface of the tape layer, and a plurality of integrated circuit (IC) die is positioned within the frame and supported by the tape layer. A panel is formed within the frame that at least partially surrounds the plurality of IC die and that contacts the tape layer.

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