Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2011-03-01
2011-03-01
Lee, Eugene (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S678000, C257S706000, C257S707000, C257S712000, C257S713000, C257S777000, C257SE23116, C257SE23123, C257SE23129, C257SE23180, C257SE23181
Reexamination Certificate
active
07898093
ABSTRACT:
An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.
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Barrow Michael
Darveaux Robert Francis
Jimarez Miguel Angel
Kim Jae Dong
Lee Ki Wook
Amkor Technology Inc.
Gumedzoe Peniel M
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
Lee Eugene
LandOfFree
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