Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2007-02-27
2007-02-27
Feely, Michael J. (Department: 1712)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S788000, C257S787000, C428S413000
Reexamination Certificate
active
10296848
ABSTRACT:
Epoxy-resin systems resistant to aging, molded materials and components generated from them, and their utilization.An epoxy-resin system especially suitable in the application of casting-resin methods comprising an epoxide-containing A component based on a glycidyl ether or glycidyl ester and a B component containing anhydride as a hardener is proposed, where a sterically hindered amine is added to the A component as a stabilizer to prevent aging of molded materials. Light-emitting components potted with it exhibit increased aging stability, especially as with respect to light yield over time. The epoxy-resin system can also be used for encapsulants and molding compositions, and can be blended with acrylates, for all applications, particularly in the exterior.
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Bogner Georg
Brunner Herbert
Hoehn Klaus
Feely Michael J.
Fish & Richardson P.C.
Osram Opto Semiconductors GmbH
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