Epoxy resin compositions and semiconductor devices encapsulated

Details Epoxy resin compositions and semiconductor devices encapsulated Epoxy resin compositions and semiconductor devices encapsulated

1999-05-06

1999-11-30

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257793, 257788, 523427, 525481, 525423, H01L 2329, C08L 6300, C08F 2800

Patent

active

059947853

ABSTRACT:
In an epoxy resin composition comprising an epoxy resin, a curing agent, and at least 70% by weight of an inorganic filler, at least one of the epoxy resin and the curing agent has such a molecular weight distribution as to provide an average dispersity Mw/Mn of less than 1.6, a two-nucleus compound content of less than 8% by weight and a seven- and more-nucleus compound content of less than 32% by weight. When the composition is cured at 180.degree. C. for 90 seconds into a primary product having Tg1 and the primary product postcured at 180.degree. C. for 5 hours into a secondary product having Tg2, the relationship: (Tg2-Tg1)/Tg2<0.1 is satisfied. The composition is fast-curing and effectively moldable and cures into a reliable product without a need for postcure.

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patent: 5739187 (1998-04-01), Asano et al.
patent: 5827908 (1998-10-01), Arai et al.
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