Search
Selected: M

Metal contact structure in semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal contact structure in semiconductor device and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal contact to a novel polysilicon contact extension

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal fill by treatment of mobility layers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal fill region of a semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal film protection of the surface of a structure formed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal film semiconductor device and a method for forming the...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal gasket for a semiconductor fabrication chamber

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnect and IC chip including metal interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnect layer of semiconductor device and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnect stack for integrated circuit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnect structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnect structure for an integrated circuit with impr

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnect structures for use with integrated circuit de

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnection and method for making

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnection structure of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Utility Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnections and active matrix substrate using the...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnections for semiconductor devices including a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal interconnects for integrated circuit die comprising...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Metal layer in semiconductor device including a planar...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.