Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate
2005-02-02
2011-12-06
Gebremariam, Samuel (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
C257S741000, C257S758000, C257SE23014, C257SE23017, C257SE23152, C257SE23154
Reexamination Certificate
active
08072066
ABSTRACT:
An integrated circuit includes a substrate; a sealing element spanning a periphery of the substrate that forms a protective boundary for the substrate; a plurality of copper lines spanning the substrate in at least two distinct layers contained within the protective boundary; a first conducting element disposed outside the sealing element; and one or more second conducting elements connecting at least two of the copper lines and that spans the sealing element; wherein the conducting elements are substantially non-oxidizing metals that are resistant to oxidization and that connect the copper line to the first conducting element.
REFERENCES:
patent: 5795796 (1998-08-01), Kim
patent: 6300223 (2001-10-01), Chang et al.
patent: 6521975 (2003-02-01), West et al.
patent: 6815821 (2004-11-01), Yu
patent: 7053453 (2006-05-01), Tsao et al.
patent: 7224042 (2007-05-01), McCollum
patent: 2002/0024115 (2002-02-01), Ibnabdeljalil et al.
patent: 2003/0089997 (2003-05-01), Mergenthaler et al.
patent: 2003/0122220 (2003-07-01), West et al.
patent: 2006/0267154 (2006-11-01), Pitts et al.
Erhardt Herbert J.
Tan Liang
Arena Andrew O.
Blakely , Sokoloff, Taylor & Zafman LLP
Gebremariam Samuel
OmniVision Technologies Inc.
LandOfFree
Metal interconnects for integrated circuit die comprising... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Metal interconnects for integrated circuit die comprising..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal interconnects for integrated circuit die comprising... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4316730