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Insulation structure for wiring which is suitable for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Insulator/metal bonding island for active-area silver epoxy...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Integral topside vacuum package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Integrated butt contact having a protective spacer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Integrated capacitor for RF applications with Ta adhesion layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Integrated chip carrier with compliant interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Integrated chip package structure using ceramic substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Integrated circuit (IC) carrier assembly incorporating an...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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Integrated circuit (IC) carrier assembly with first and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Integrated circuit (IC) carrier assembly with suspension means

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Integrated circuit aluminum contact structure to silicon device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With means to prevent contact from penetrating shallow pn...
Patent

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Integrated circuit and associated fabrication process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Integrated circuit and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Integrated circuit and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
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Integrated circuit and method of forming the integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Integrated circuit and seed layers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Integrated circuit and seed layers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Integrated circuit and seed layers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Integrated circuit arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Integrated circuit arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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