Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-12-11
2007-12-11
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S734000, C257S738000, C257S773000, C257S776000, C257SE23015, C257SE23020, C257SE23021, C257SE23067, C257SE23069, C361S787000, C361S789000, C361S791000, C361S760000
Reexamination Certificate
active
11758644
ABSTRACT:
An integrated circuit (IC) carrier assembly includes a printed circuit board (PCB). A carrier is soldered to the PCB. The carrier includes a grid of electrical contact islands surrounding a receiving zone for receiving an IC. Pairs of adjacent islands are interconnected by respective resilient suspension means. The IC is received in the receiving zone and is electrically coupled to a number of the plurality of islands adjacent to the receiving zone. The IC is fast to a retainer, and the retainer is fast with the number of the plurality of islands and the IC.
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Clark Jasmine
Silverbrook Research Pty Ltd
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