Integrated chip carrier with compliant interconnects

Details Integrated chip carrier with compliant interconnects Integrated chip carrier with compliant interconnects

2011-03-01

2011-03-01

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE21597, C257S621000, C257S773000, C257S774000, C438S638000, C438S675000, C438S700000

Reexamination Certificate

active

07898087

ABSTRACT:
An electronic device includes: at least one electronic chip comprising a first coefficient of thermal expansion (CTE); and a carrier including a top surface connected to the bottom surface of the chip by solder bumps. The carrier further includes a second CTE that approximately matches the first CTE, and a plurality of through vias from the bottom surface of the carrier to the top surface of the carrier layer. Each through via includes a collar exposed at the top surface of the carrier, a pad exposed at the bottom surface of the carrier, and a post disposed between the collar and the pad. The post extends thorough a volume of space.

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