Integrated circuit (IC) carrier assembly with first and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Details

C257SE23015, C257S737000, C361S787000

Reexamination Certificate

active

07919872

ABSTRACT:
An integrated circuit (IC) carrier assembly comprises a printed circuit board (PCB), a carrier soldered to the PCB, the carrier comprising a plurality of electrical contact islands surrounding a receiving zone for receiving an IC, a first resilient suspension means interconnecting pairs of adjacent islands, and a second resilient suspension means connecting the islands adjacent to the receiving zone with the receiving zone.

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patent: WO 99/59206 (1999-11-01), None

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