Integrated circuit and method of fabricating the same

Details Integrated circuit and method of fabricating the same Integrated circuit and method of fabricating the same

2011-07-05

2011-07-05

Wagner, Jenny L. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257SE23020, C438S612000

Reexamination Certificate

active

07973417

ABSTRACT:
An article including a substrate having a blind hole formed therein, wherein the blind hole is defined by a floor and a sidewall and a solder connection is provided. The solder connection may couple a first contact pad to a second contact pad. The first contact pad may cover a first field of the floor of the blind hole, and may also promote wetting of a solder material of the solder connection. Wetting may be impeded on a second field of the floor of the blind hole. The second contact pad may be arranged above a surface of a further substrate, wherein the surface of the further substrate may be oriented perpendicularly to the floor of the blind hole in the substrate.

REFERENCES:
patent: 5135606 (1992-08-01), Kato et al.
patent: 5587623 (1996-12-01), Jones
patent: 5747101 (1998-05-01), Booth et al.
patent: 6047044 (2000-04-01), Lehmann et al.
patent: 6191952 (2001-02-01), Jimarez et al.
patent: 6245595 (2001-06-01), Nguyen et al.
patent: 6495916 (2002-12-01), Ohuchi et al.
patent: 6683379 (2004-01-01), Haji et al.
patent: 7217890 (2007-05-01), Suemasu et al.
patent: 7263769 (2007-09-01), Morimoto et al.
patent: 7745321 (2010-06-01), Martin et al.
patent: 7814651 (2010-10-01), Suemasu et al.
patent: 7829380 (2010-11-01), Irsigler et al.
patent: 2003/0001992 (2003-01-01), Kawase et al.
patent: 2006/0180940 (2006-08-01), Kirby et al.
patent: 2006/0261493 (2006-11-01), Boon
patent: 2008/0099925 (2008-05-01), Irsigler et al.
patent: 2009/0179333 (2009-07-01), Martin et al.
patent: 19542043 (1996-08-01), None
patent: 19729596 (1999-01-01), None
patent: 10351924 (2004-06-01), None
patent: 01144653 (1989-06-01), None
patent: 3627856 (2002-05-01), None
patent: 2002158191 (2005-03-01), None
Office Action History of U.S. Appl. No. 11/972,973, dates ranging from Sep. 3, 2009 to Feb. 5, 2010.
Office Action History of U.S. Appl. No. 11/589,986, dates ranging from Jun. 12, 2008 to Jun. 30, 2010.

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