Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2007-10-02
2007-10-02
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S437000, C257S433000
Reexamination Certificate
active
10750580
ABSTRACT:
An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
REFERENCES:
patent: 4001586 (1977-01-01), Fraioli
patent: 4536608 (1985-08-01), Sheng et al.
patent: 5895233 (1999-04-01), Higashi et al.
patent: 6036872 (2000-03-01), Wood et al.
patent: 6252229 (2001-06-01), Hays et al.
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6359333 (2002-03-01), Wood et al.
patent: 6627892 (2003-09-01), Cole
patent: 6686653 (2004-02-01), Jerominek et al.
patent: 6897469 (2005-05-01), Syllaios et al.
patent: 2002/0117623 (2002-08-01), Cole
patent: 2002/0135869 (2002-09-01), Banish et al.
patent: 2003/0111441 (2003-06-01), Jerominek et al.
patent: 2000337959 (2001-04-01), None
Motamedi et al., “Antireflection Surfaces in Silicon Using Binary Optics Technology,” Applied Optics, vol. 31, No. 2, pp. 4371-4376, Aug. 1, 2002.
Higashi Robert E.
Newstrom-Peitso Karen M.
Ridley Jeffrey A.
Fredrick Kris T.
Honeywell International , Inc.
Huynh Andy
Nguyen Thinh T
LandOfFree
Integral topside vacuum package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integral topside vacuum package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integral topside vacuum package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3833505