Copper-alloy interconnection layer
Copper-aluminum metallization
Copper-containing plug for connection of semiconductor surface w
Corrosion-resistant electrode structure for integrated...
Crack stop and moisture barrier
Crossbar-array designs and wire addressing methods that...
Crossed power strapped layout for full CMOS circuit design
Cu film deposition equipment of semiconductor device
Cu interconnects with composite barrier layers for...
Cu-A1 combined interconnect system
Cu/low-k BEOL with nonconcurrent hybrid dielectric interface
CuSiN/SiN diffusion barrier for copper in integrated-circuit...
CVD silicon carbide layer as a BARC and hard mask for gate...
CVD source material for forming an electrode, and electrode...
Damascene conductors with embedded pillars
Damascene interconnect structure with cap layer
Damascene interconnection structure and dual damascene...
Damascene metallization process and structure
Damascene processing employing low Si-SiON etch stop layer/arc
Damascene structure fabricated using a layer of...