Flip-chip package containing a chip and a substrate having...
Flip-chip package integrating optical and electrical devices...
Flip-chip package utilizing a printed circuit board having a...
Flip-chip packaged SMD-type LED with antistatic function and...
Flip-chip semiconductor device utilizing an elongated tip bump
Flip-chip semiconductor device with enhanced reliability and man
Flip-chip semiconductor devise having an electrode pad covered w
Flip-chip semiconductor package
Flip-chip semiconductor package structure and process for...
Flip-chip system and method of making same
Flip-chip transition interface structure
Flip-chip type connection with elastic contacts
Flip-chip type semiconductor device
Flip-chip with matched lines and ground plane
Flip-chip with matched signal lines, ground plane and ground...
Front side coating for bump devices
Functional device unit and method of producing the same
Glass frit wafer bonding process and packages formed thereby
Heat dissipating flip-chip ball grid array
Hermetically self-sealing flip chip