Flip-chip packaged SMD-type LED with antistatic function and...

Details Flip-chip packaged SMD-type LED with antistatic function and... Flip-chip packaged SMD-type LED with antistatic function and...

2006-08-29

2006-08-29

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S666000, C257SE23001

Reexamination Certificate

active

07098543

ABSTRACT:
A flip-chip packaged SMD-type (surface-mount device) light emitting diode is provided. The light emitting diode chip is packaged in flip chip packages and is connected with an electrostatic protection device such as a transient voltage suppressor (TVS) or a Zener diode. The electrostatic protection device is attached with a substrate so as to form a flip-chip packaged SMD-type light emitting diode. The light emitting diode chip is connected to a lead frame of the substrate by a high electrical and heat conductive component thus the device needs no wire bonding. Due to the electrostatic protection device, the device has static control effect.

REFERENCES:
patent: 6876008 (2005-04-01), Bhat et al.
patent: 6949773 (2005-09-01), Shin
patent: 2004/0026708 (2004-02-01), Chen

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