Flip-chip package integrating optical and electrical devices...

Details Flip-chip package integrating optical and electrical devices... Flip-chip package integrating optical and electrical devices...

2006-05-23

2006-05-23

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000

Reexamination Certificate

active

07049704

ABSTRACT:
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.

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