Flip-chip type semiconductor device

Details Flip-chip type semiconductor device Flip-chip type semiconductor device

2007-05-11

2009-06-30

Quach, Tuan N. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S787000, C257SE23116

Reexamination Certificate

active

07554205

ABSTRACT:
A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.

REFERENCES:
patent: 5492863 (1996-02-01), Higgins, III
patent: 5930599 (1999-07-01), Fujimoto et al.
patent: 5981313 (1999-11-01), Tanaka
patent: 6049038 (2000-04-01), Suzuki
patent: 6350664 (2002-02-01), Haji et al.
patent: 6780682 (2004-08-01), Pendse
patent: 6798072 (2004-09-01), Kajiwara et al.
patent: 6833180 (2004-12-01), Kodemura
patent: 6838316 (2005-01-01), Lizuka et al.
patent: 2002/0197770 (2002-12-01), Irie
patent: 03-012942 (1991-01-01), None
patent: 11 274241 (1999-10-01), None
patent: 11 297750 (1999-10-01), None
patent: 11-307586 (1999-11-01), None
patent: 2000-252320 (2000-09-01), None
patent: 2001 176898 (2001-06-01), None
patent: 2002-100730 (2002-04-01), None
patent: 2002-280401 (2002-09-01), None
patent: 2003-168700 (2003-06-01), None

Affiliated with

Also associated with

Rating

Flip-chip type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip type semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4075602