Heat dissipating flip-chip ball grid array
Hermetically self-sealing flip chip
Hexagonal arrangements of bump pads in flip-chip integrated...
High density chip level package for the packaging of...
High density flip chip memory arrays
High density integrated circuit packages and method for the...
High performance flip-chip semiconductor device
High performance thermally enhanced package and method of...
High speed I/O pad and pad/cell interconnection for flip chips
High temperature flip chip joining flux that obviates the...
High voltage flip-chip component package and method for...
High wireability microvia substrate
High wireability microvia substrate
High-frequency semiconductor device including a...
High-reliable semiconductor device using hermetic sealing of...
Hybrid bump capacitor
Hybrid integrated circuit package substrate