Hermetically self-sealing flip chip

Details Hermetically self-sealing flip chip Hermetically self-sealing flip chip

1994-06-14

1996-11-26

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257779, H01L 2348

Patent

active

055788742

ABSTRACT:
A package containing an integrated circuit has all of its I/O contacts on one of the package faces. The periphery of that face is processed to be wettable with solder. The substrate to which the package is to be attached has corresponding contacts and has a solder wettable ring comparable to the ring at the periphery at the package face. When the package is positioned on the substrate it is hermetically sealed therearound by soldering the two rings together, such as by reflow soldering.

REFERENCES:
patent: 3657610 (1972-04-01), Yamamoto et al.
patent: 5281151 (1994-01-01), Arima et al.

Affiliated with

Also associated with

Rating

Hermetically self-sealing flip chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically self-sealing flip chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically self-sealing flip chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1975268