Selective solder bump application
Selective underfill for flip chips and flip-chip assemblies
Self alignment features for an electronic assembly
Semi-conductor die interconnect
Semiconducting device with folded interposer
Semiconductor and flip chip packages and method having a...
Semiconductor apparatus and semiconductor apparatus...
Semiconductor bare chip, method of manufacturing...
Semiconductor chip and multichip-type semiconductor device
Semiconductor chip and production process therefor
Semiconductor chip and semiconductor device, and method for...
Semiconductor chip and semiconductor device, and method for...
Semiconductor chip assembly
Semiconductor chip assembly with embedded metal pillar
Semiconductor chip assembly with welded metal pillar
Semiconductor chip package and fabrication method thereof
Semiconductor chip package structure for achieving flip-chip...
Semiconductor chip with reinforcement structure
Semiconductor chip with solder joint protection ring
Semiconductor chip—mounting board