Semiconductor chip with reinforcement structure

Details Semiconductor chip with reinforcement structure Semiconductor chip with reinforcement structure

2008-06-04

2010-06-15

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S786000, C257SE21503, C438S108000, C438S126000

Reexamination Certificate

active

07737563

ABSTRACT:
Various semiconductor chip reinforcement structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate wherein the semiconductor chip has a first side facing toward but separated from a second of the substrate to define an interface region. An array of electrical interconnects is provided between the semiconductor chip and the substrate positioned in the interface region. A reinforcement structure is coupled to the first side of the semiconductor chip and the second side of the substrate and in the interface region while outside the array of electrical interconnects. An underfill is provided in the interface region.

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Marie-Claude Paquet et al.;Underfill Selection Strategy for Pb-Free, Low-K and Fine Pitch Organic Flip Chip Applications; 2006 Electronic Components and Technology Conference; 1-4244-0152-6/06/$20.00 © 2006 IEEE; pp. 1595-1603.
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