Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-12-26
2006-12-26
Owens, Douglas W. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S693000, C257S773000
Reexamination Certificate
active
07154187
ABSTRACT:
A semiconductor chip is provided comprising a semiconductor substrate on which an integrated circuit is formed. The semiconductor chip, which is provided on the semiconductor substrate in an area array, further comprises a plurality of electrodes electrically coupled with the inside of the semiconductor substrate, wherein the electrodes are arranged into a plurality of first groups respectively lined along a plurality of paralleling first straight lines and, further, into a plurality of second groups respectively lined along a plurality of second straight lines which extend so as to intersect with the first straight lines.
REFERENCES:
patent: 6611053 (2003-08-01), Akram
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patent: 04-352132 (1992-12-01), None
patent: 08-279535 (1996-10-01), None
patent: 2000-286291 (2000-10-01), None
patent: 2003-124318 (2003-04-01), None
patent: 2003-332380 (2003-11-01), None
Communication from Japanese Patent Office re: counterpart application.
Owens Douglas W.
Seiko Epson Corporation
Taylor Earl
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