Semiconductor chip with solder joint protection ring

Details Semiconductor chip with solder joint protection ring Semiconductor chip with solder joint protection ring

2011-04-12

2011-04-12

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

Reexamination Certificate

active

07923850

ABSTRACT:
Various semiconductor chip arrangements and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip that has an external peripheral wall to a first side of a substrate. A first metallic ring is coupled to the first side of the substrate. The first metallic ring has an internal peripheral wall that frames the semiconductor chip and is separated from the external peripheral wall by a gap. The first metallic ring has a coefficient of thermal expansion less than about 6.0 10−6K−1.

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