Self alignment features for an electronic assembly

Details Self alignment features for an electronic assembly Self alignment features for an electronic assembly

2006-09-20

2009-08-04

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S779000, C257S780000, C257S797000, C257S737000, C257S738000, C257SE23068, C257SE23069, C257SE23179, C228S180220

Reexamination Certificate

active

07569939

ABSTRACT:
Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the substrate and a group of mating bumps on the other of the die and the substrate. The group of mating bumps is positioned such that if the alignment bump engages each of the mating bumps, the die is appropriately positioned relative to the substrate at that location where the alignment bump engages the group of mating bumps. In some embodiments, the alignment bump extends from the substrate while in other embodiments the alignment bump extends from the die. The alignment bump on the substrate (or die) may be part of a plurality of alignment bumps such that each alignment bump engages a different group of mating bumps on the die (or substrate).

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