Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-05-02
2009-11-10
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S737000, C257S784000
Reexamination Certificate
active
07615874
ABSTRACT:
An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular. The plurality of bonding material applying lands are arranged on the rear surface. The plurality of bonding material applying lands includes outer peripheral land rows, each of which is arranged in a line along each side of the rear surface with the exception of corner portions of the rear surface. The plurality of bonding material applying lands includes corner portion inner lands, each of which is arranged on the rear surface at a location that is shifted inwardly in a substantially diagonal direction from the corner portion and is adjacent to the bonding material applying lands closest to the corner portion at ends of the outer peripheral land rows that are arranged in lines along two sides that are connected by the corner portion.
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Official Communication for PCT Application No. PCT/JP2006/306437; mailed Jun. 27, 2006.
Official communication issued in counterpart Korean Application No. 10-2007-7009850, mailed on Feb. 28, 2008.
Higashibata Kazuaki
Hosokawa Toshihiro
Kawata Masaki
Suesada Tsuyoshi
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
Nguyen Cuong Q
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