Electronic component with semiconductor chips, electronic...

Details Electronic component with semiconductor chips, electronic... Electronic component with semiconductor chips, electronic...

2002-04-25

2008-03-11

Im, Junghwa (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S686000, C257S777000, C257S723000, C257S620000, C257S737000, C257S619000

Reexamination Certificate

active

07342320

ABSTRACT:
An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connections being provided in the form of structured conductive tracks for providing an electrical connection from the active front face to the passive rear face. An electronic assembly formed of stacked semiconductor chips, and a method for producing the electronic component and the electronic assembly are also provided.

REFERENCES:
patent: 4249299 (1981-02-01), Stephens et al.
patent: 5736456 (1998-04-01), Akram
patent: 5770884 (1998-06-01), Pogge et al.
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5962917 (1999-10-01), Moriyama
patent: 5977640 (1999-11-01), Bertin et al.
patent: 5986338 (1999-11-01), Nakajima
patent: 5990545 (1999-11-01), Schueller et al.
patent: 6097091 (2000-08-01), Ohsumi
patent: 6107109 (2000-08-01), Akram et al.
patent: 6111317 (2000-08-01), Okada et al.
patent: 6249053 (2001-06-01), Nakata et al.
patent: 6291259 (2001-09-01), Chun
patent: 6407458 (2002-06-01), Huemoeller
patent: 6577013 (2003-06-01), Glenn et al.
patent: 6777767 (2004-08-01), Badehi
patent: 2001/0018236 (2001-08-01), Badehi
patent: 198 40 248 (2000-03-01), None
patent: 2 345 383 (2000-07-01), None
patent: 57-10251 (1982-01-01), None
patent: WO 99/08318 (1999-02-01), None

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