High-frequency module, method of manufacturing thereof and...

High-voltage module and method for producing same

Highly moisture-sensitive electronic device element and...

Injection of encapsulating material on an optocomponent

Integrated circuit package system with package integration

Integrated circuit package with bond wires at the corners of...

Integrated circuit package with etched leadframe for...

Integrated circuit packaging system with conductive pillars...

Integrated circuit protection and ruggedization coatings and...

Integrated circuit underfill package system

Lid made of resin for case for accommodating solid-state...

Lid made of resin for case for accommodating solid-state...

Manufacturing method and manufacturing device of microstructure

Manufacturing method for electronic component with sealing film

Method and apparatus for molding a flip chip semiconductor...

Method and apparatus for packaging a microelectronic die

Method and apparatus for packaging a microelectronic die

Method and apparatus for sealing a ball grid array package...

Method and structure for packaging an integrated circuit with re

Method and system for exposed die molding for integrated...