Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2006-08-23
2011-12-13
Garber, Charles (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257SE21502, C438S106000
Reexamination Certificate
active
08076185
ABSTRACT:
An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component.
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Office A
Boone Alan P.
Lower Nathan P.
Wilcoxon Ross K.
Barbieri Daniel M.
Garber Charles
Rockwell Collins, Inc.
Sene Pape
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