Package stress management
Package structure with a retarding structure and method of...
Packaging structure of SIP and a manufacturing method thereof
Partial underfill for flip-chip electronic packages
Passivation layer for packaged integrated circuits
Plastic package assembly method for a ferroelectric-based...
Plastic packaged device with die interface layer
Plating method, semiconductor device fabrication method and...
Pressurized underfill encapsulation of integrated circuits
Process for exposing solder bumps on an underfill coated...
Process for forming an edge structure to seal integrated...
Process for forming encapsulated electronic devices
Process for improving the adhesion between metal and plastic...
Process for manufacturing transponders of small dimensions
Process for precise encapsulation of flip chip interconnects
Process for producing a functional device-mounted module
Process for producing a semiconductor chip
Process of making an integrated circuit chip composite including
Protective film for the fabrication of direct build-up...