Manufacturing method for electronic component with sealing film

Details Manufacturing method for electronic component with sealing film Manufacturing method for electronic component with sealing film

2011-01-11

2011-01-11

Smith, Matthew S (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S787000, C257SE23116, C438S051000, C438S052000

Reexamination Certificate

active

07867830

ABSTRACT:
A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing the first region and the second region each other, and connecting the first substrate and the second substrate while disposing at least a part of a functional element within a space between the first region and the second region; obtaining a plurality of first divisional substrates by cutting the first substrate at each of the first regions, after the connecting of the first substrate and the second substrate; forming a sealing film covering the plurality of the first divisional substrates on the second substrate, after cutting the first substrate; obtaining a plurality of second divisional substrates by cutting the second substrate at each of the second regions, after forming the sealing film; and obtaining a plurality of individual electronic devices.

REFERENCES:
patent: 5668057 (1997-09-01), Eda et al.
patent: 5798557 (1998-08-01), Salatino et al.
patent: 5915168 (1999-06-01), Salatino et al.
patent: 6914367 (2005-07-01), Furukawa
patent: 7011986 (2006-03-01), Daeche et al.
patent: 7211934 (2007-05-01), Fujiwara et al.
patent: 2003/0112986 (2003-06-01), Furukawa
patent: 2004/0257478 (2004-12-01), Su
patent: 2005/0023661 (2005-02-01), Matsubara et al.
patent: 2005/0104204 (2005-05-01), Kawakubo et al.
patent: 2006/0103003 (2006-05-01), Heide et al.
patent: 2006/0180897 (2006-08-01), Park et al.
patent: 2007/0108634 (2007-05-01), Higashi et al.
patent: 11-087406 (1999-03-01), None
patent: 11-097584 (1999-04-01), None
patent: 11-150440 (1999-06-01), None
patent: 2000-077458 (2000-03-01), None
patent: 2000-261284 (2000-09-01), None
patent: 2000261284 (2000-09-01), None
patent: 2001-244785 (2001-09-01), None
patent: 2003-092382 (2003-03-01), None
patent: 2004-129088 (2004-04-01), None
patent: 2004-135193 (2004-04-01), None
patent: 2004-214469 (2004-07-01), None
patent: 2005-109221 (2005-04-01), None
patent: 2006-517057 (2006-07-01), None
patent: WO 03/086956 (2003-10-01), None
patent: WO 2005055317 (2005-06-01), None

Affiliated with

Also associated with

Rating

Manufacturing method for electronic component with sealing film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method for electronic component with sealing film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for electronic component with sealing film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2633421