Lid made of resin for case for accommodating solid-state...

Details Lid made of resin for case for accommodating solid-state... Lid made of resin for case for accommodating solid-state...

2008-07-08

2008-07-08

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S126000, C438S125000, C438S048000, C257S704000, C257S434000, C359S811000

Reexamination Certificate

active

07396704

ABSTRACT:
This method of manufacturing a lid made of a transparent resin comprises a step of introducing a resin into a cavity for molding a protrusion continuous with a cavity for molding a lid in a die; a step of forming a molded body including a lid and a protrusion continuous with the lid by solidifying the resin in the cavity for molding a lid and the cavity for molding a protrusion, respectively; a step of separating the molded body from the die by ejecting an ejector pin to the protrusion; and a step of separating the protrusion from the lid.

REFERENCES:
patent: 5329406 (1994-07-01), Nakanishi et al.
patent: 5975882 (1999-11-01), Nomura et al.
patent: 5982565 (1999-11-01), Nomura et al.
patent: 6144505 (2000-11-01), Nakanishi et al.
patent: 6437928 (2002-08-01), Togashi
patent: 6483030 (2002-11-01), Glenn et al.
patent: 6870259 (2005-03-01), Silverbrook
patent: 11-177074 (1999-07-01), None

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