Integrated circuit packaging system with conductive pillars...

Details Integrated circuit packaging system with conductive pillars... Integrated circuit packaging system with conductive pillars...

2011-04-12

2011-04-12

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S611000

Reexamination Certificate

active

07923304

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive pillar, having substantially parallel vertical sides, in direct contact with the substrate; mounting an integrated circuit to the substrate beside the conductive pillar; and encapsulating the integrated circuit with an encapsulation having a top surface formed for the conductive pillar to extend beyond.

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