Integrated circuit package system with package integration

Details Integrated circuit package system with package integration Integrated circuit package system with package integration

2007-12-17

2011-11-29

Nguyen, Ha Tran T. (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S787000

Reexamination Certificate

active

08067275

ABSTRACT:
An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.

REFERENCES:
patent: 7199465 (2007-04-01), Lim
patent: 2004/0113253 (2004-06-01), Karnezos
patent: 2006/0244157 (2006-11-01), Carson
patent: 2006/0267609 (2006-11-01), Lee et al.
patent: 2007/0141754 (2007-06-01), Lim
patent: 2007/0246815 (2007-10-01), Lu et al.

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