Integrated circuit underfill package system

Details Integrated circuit underfill package system Integrated circuit underfill package system

2006-01-31

2009-02-03

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S108000, C257S787000, C257SE23133

Reexamination Certificate

active

07485502

ABSTRACT:
An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.

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