Process of making an integrated circuit chip composite including

Details Process of making an integrated circuit chip composite including Process of making an integrated circuit chip composite including

Filed on

1995-05-19

Date issued

1997-04-22

Examiner

Niebling, John

Patent Class

Semiconductor device manufacturing: process

SubClass

Packaging or treatment of packaged semiconductor

SubSubClass

Encapsulating

Other Related Categories

29855, H01L 2156

Type

Patent

Status

active

Patent number

056228988

Description

ABSTRACT:
A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.

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