Process for exposing solder bumps on an underfill coated...

Details Process for exposing solder bumps on an underfill coated... Process for exposing solder bumps on an underfill coated...

2005-07-22

2008-03-04

Pham, Thanhha S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S126000, C438S613000

Reexamination Certificate

active

07338842

ABSTRACT:
A process for applying a solvent-free underfill onto a bumped semiconductor comprises: providing an underfill in a compressible state on a semiconductor, contacting the underfill with a compliant surface and applying sufficient pressure to expose the bumps, optionally hardening the underfill to a solid state, and removing the compliant surface.

REFERENCES:
patent: 6000127 (1999-12-01), Eifuku et al.
patent: 6179198 (2001-01-01), Eifuku et al.
patent: 6209196 (2001-04-01), Ozono et al.
patent: 6333206 (2001-12-01), Ito et al.
patent: 2005/0048693 (2005-03-01), Yoon
patent: 2006/0134901 (2006-06-01), Chaware et al.

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